| 摘要 |
The electronic device according to the Present Disclosure is an electronic device provided with a heat-dissipating portion and an electronic component socket that can accommodate, therein, an installable electronic component, wherein the electronic component socket has a thermal connecting portion for connecting thermally to the electronic component, and, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion. |
| 主权项 |
1. An electronic device, the electronic device comprising:
an electronic component socket, the electronic component socket accommodating an installable electronic component therein, the electronic component socket including a thermal connecting portion, the thermal connecting portion being connected thermally to the electronic component, the thermal connecting portion including a transporting member, the transporting member including an interior space, a vapor diffusing space, a coolant return flow space and an interference-preventing plate, a coolant being sealed within the interior space, the vapor diffusing space for diffusing vaporized coolant included within the interior space, condensed coolant flowing back to the coolant return flow space, the interference-preventing plate preventing interference between the vaporized coolant and the condensed coolant; and a heat-dissipating portion. |
