发明名称 METHOD OF MANUFACTURING LAYER STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a method in which a layer having large layer thickness and high material quality and using gallium nitride as a base is epitaxially deposited on a silicon surface.SOLUTION: Disclosed is a method of manufacturing a layer structure 100 which includes the steps of: forming a carrier substrate 1 having the silicon surface 1a; and depositing a series of layers on the silicon surface 1a in the growth direction R. The series of layers includes a GaN layer 5 formed by using gallium nitride, and masking layer 12 formed by using silicon nitride. In the growth direction R, the masking layer 12 follows the rear of at least a portion of the GaN layer 5.
申请公布号 JP2015181180(A) 申请公布日期 2015.10.15
申请号 JP20150097663 申请日期 2015.05.12
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 PETER STAUSS;PHILIPP DRECHSEL
分类号 H01L21/205;H01L33/12;H01L33/32 主分类号 H01L21/205
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