发明名称 |
METHOD OF MANUFACTURING LAYER STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method in which a layer having large layer thickness and high material quality and using gallium nitride as a base is epitaxially deposited on a silicon surface.SOLUTION: Disclosed is a method of manufacturing a layer structure 100 which includes the steps of: forming a carrier substrate 1 having the silicon surface 1a; and depositing a series of layers on the silicon surface 1a in the growth direction R. The series of layers includes a GaN layer 5 formed by using gallium nitride, and masking layer 12 formed by using silicon nitride. In the growth direction R, the masking layer 12 follows the rear of at least a portion of the GaN layer 5. |
申请公布号 |
JP2015181180(A) |
申请公布日期 |
2015.10.15 |
申请号 |
JP20150097663 |
申请日期 |
2015.05.12 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
PETER STAUSS;PHILIPP DRECHSEL |
分类号 |
H01L21/205;H01L33/12;H01L33/32 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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