SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND RECORDING MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which is helpful for reducing influence of warpage of a substrate on exposure processing and concurrently inhibiting deterioration of the throughput, and to provide a substrate processing method and a recording medium.SOLUTION: A coat/development apparatus 2 includes: a COT module 15; an interface block 6; a BSI unit 20 for obtaining measurement data related to warpage of a wafer W; a communication part 200 for conducting data communication with an exposure device 3; and a control unit 100. The control unit 100 includes: a film formation control section which controls the COT module 15; a relay control section which controls the interface block 6 so that a substrate is sent to the exposure device; a measurement control section which controls the BSI unit 20 so that the BSI unit 20 obtains the measurement date related to the warpage after control by the film formation control section and before control of the relay control section; and a communication control section which controls the communication part 200 so that the measurement data related to the warpage is transmitted to the exposure device 3.