WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SURFACE MODIFICATION METHOD FOR INSULATION LAYER

摘要

PROBLEM TO BE SOLVED: To provide a wiring board or the like which is improved in reliability by reducing the residue generated on the outermost surface of an insulation layer.SOLUTION: This wiring substrate includes an insulation layer and a pad exposed from the insulation layer. The outermost surface of the insulation layer is modified have a hydrophobic property by stamping silicone thereon.