| 摘要 |
An exemplary embodiment of the present disclosure includes a PCB (Printed Circuit Board) mounted with an image sensor, a housing disposed at coupled to an upper surface of the PCB, a holder module spaced from a bottom surface of the housing at a predetermined distance, wound with a first coil at a periphery and including thereinside at least one or more lenses, a connecting portion disposed at coupled to an upper surface of the holder module and including a conductive pattern, a plate member coupled to a bottom surface of the holder module, and a plurality of wire springs connected at one end to the connecting portion and connected at the other distal end to the plate member. |
