THERMALLY CONDUCTIVE SILICONE COMPOSITION AND ELECTRICAL/ELECTRONIC APPARATUS

摘要

Provided are: a thermally conductive silicone composition which has excellent heat resistance and thermal conductivity, in which viscosity is suppressed in an uncured state, and which has excellent handleability; and an electrical/electronic apparatus in which said thermally conductive silicone composition is used as a member. The thermally conductive silicone composition is formed by containing 100 parts by mass of: (A) either (a1) an organopolysiloxane having, in each molecule thereof, an alkoxysilyl-containing group that has at least one silicon atom bond and is represented by the general formula disclosed herein or a mixture of the (a1) component and (a2) an organopolysiloxane that has at least two alkenyl groups in each molecule thereof and does not have the alkoxysilyl-containing group {in the mixture, the content of the (a1) component is 10-100 mass% (however, 100 mass% is not included)}; and (B) 400-3500 parts by mass of a thermally conductive filler.