| 摘要 |
This cooling housing (11) for an electronic device (10) comprises: a floor part (15) having formed therein a cooling flow path (15D) through which a coolant flows; a first arrangement part (16) that is provided on one of the front and back surfaces of the floor part (15), and in which a first electronic component (22, 33, 34) is arranged; a second arrangement part (17) that is provided on the other one of the front and back surfaces of the floor part (15), and in which a second electronic component (31, 32) is arranged; and a third arrangement part (18) that is in communication with the first arrangement part (16) and the second arrangement part (17) via an opening (15A) provided in the floor part (15). In the third arrangement part (18), a smoothing capacitor unit (41), which is integrally provided with a first electricity storage part (41A) for a circuit provided in the first electronic component (21) and a second electricity storage part (41B) for a circuit provided in the second electronic component (31, 32), is arranged so as to straddle the floor part (15). |
