BALL GRID ARRAY MOUNTING SYSTEM

摘要

A device for providing a reliable and robust electrical connection of a chip to a board using a plurality of solder balls, the device including a non-rigid body formed of a thermal resistant material having a top side and a bottom side, the bottom side having an adhesive layer; and an array of openings formed in the body, the array of openings arranged in a pattern that matches a pattern of conductive pads on the board, each opening having a circular plan form shape that is sized to enable a single solder ball to be slideably received in the opening, each opening spaced from adjacent openings by a distance that prevents adjacent solder balls from electrically connecting to each other when the solder balls are subjected to a temperature sufficient to reflow the solder ball.

主权项

1. A device for providing a reliable and robust electrical connection of a ball grid array assembly to a board using a plurality of solder balls, the ball grid array assembly having a plurality of conductive pads arranged in a pattern, the board also having a plurality of conductive pads arranged in a pattern that is a mirror of the pattern on the board, the device comprising:
a non-rigid body comprising a thermal resistant material having a top side and a bottom side, the bottom side having an adhesive layer; and an array of openings in the body, the array of openings arranged in a pattern that matches the pattern of the conductive pads on the ball grid array assembly, each opening having a circular plan form shape that is sized to enable a single solder ball to be slideably received in the opening, each opening spaced from adjacent openings by a distance that prevents adjacent solder balls from electrically connecting to each other when the solder balls are subjected to a temperature sufficient to reflow the solder ball.