发明名称 SEALING RESIN, SEMICONDUCTOR DEVICE, AND PHOTOCOUPLER
摘要 A semiconductor device includes: a sealing resin and a semiconductor element. The sealing resin includes a base resin and a curing agent. The base resin includes isocyanuric acid having an epoxy group. The curing agent includes an acid anhydride having an acid anhydride group. A mole ratio of the acid anhydride group to the epoxy group is not less than 0.67 and not more than 0.8. A semiconductor element is covered with the sealing resin.
申请公布号 US2015295121(A1) 申请公布日期 2015.10.15
申请号 US201514751687 申请日期 2015.06.26
申请人 Kabushiki Kaisha Toshiba 发明人 Muranaka Tetsuya;Inoue Kayo;Ikedo Yuichi
分类号 H01L31/167;H04B10/80 主分类号 H01L31/167
代理机构 代理人
主权项 1. A photocoupler, comprising: an inner resin including a base resin and a curing agent, the base resin including isocyanuric acid having an epoxy group, the curing agent including an acid anhydride having an acid anhydride group, a mole ratio of the acid anhydride group to the epoxy group being not less than 0.67 and not more than 0.8, the inner resin containing an internal lubricant wax having high polarity and a fatty acid, and a second external lubricant wax having low polarity; a light emitting element provided in the inner resin; a light receiving element provided in the inner resin; and an outer resin provided around the inner resin, the outer resin containing a first external lubricant wax having low polarity.
地址 Tokyo JP