发明名称 INSULATING GATE-TYPE SEMICONDUCTOR DEVICE AND INSULATING GATE-TYPE SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 This insulating gate-type semiconductor device has a semiconductor substrate, a front surface electrode, and a rear surface electrode, and performs switching between the front surface electrode and the rear surface electrode. The insulating gate-type semiconductor device has: a first outer peripheral trench that is formed in the front surface of the semiconductor substrate; a second outer peripheral trench, which is formed in the front surface of the semiconductor substrate, and which is deeper than the first outer peripheral trench; a second conductivity-type fifth region that is exposed from the bottom surface of the first outer peripheral trench; a second conductivity-type sixth region, which is exposed from the bottom surface of the second outer peripheral trench, and which has a front surface-side end portion thereof positioned further toward the rear surface side than a rear surface-side end portion of the fifth region; and a first conductivity-type seventh region that isolates the fifth region from the sixth region.
申请公布号 WO2015156023(A1) 申请公布日期 2015.10.15
申请号 WO2015JP53692 申请日期 2015.02.10
申请人 TOYOTA JIDOSHA KABUSHIKI KAISHA;DENSO CORPORATION 发明人 SAITO JUN;IKEDA TOMOHARU;SHOJI TOMOYUKI;YAMAMOTO TOSHIMASA
分类号 H01L29/06;H01L29/78 主分类号 H01L29/06
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