| 发明名称 |
LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
The present disclosure provides a method for forming a light-emitting apparatus, comprising providing a carrier having a plurality of first metal contacts; forming a light-emitting structure comprising a substrate, a first cladding layer on the substrate, an active layer on the first cladding layer, and a second cladding layer on the active layer; bonding the light-emitting structure to the carrier; forming a cap layer on a side of the light-emitting structure opposite to the carrier; and cutting the carrier and the cap layer to form a chip-scale LED unit. |
| 申请公布号 |
US2015295154(A1) |
申请公布日期 |
2015.10.15 |
| 申请号 |
US201514687369 |
申请日期 |
2015.04.15 |
| 申请人 |
EPISTAR CORPORATION |
发明人 |
TU Chuan-Cheng;WU Jen-Chau;SHIEH Yuh-Ren;CHEN Tzer-Perng;HSIEH Min-Hsun |
| 分类号 |
H01L33/62;H01L33/50;H01L33/60;H01L33/22;H01L33/54;H01L33/56 |
主分类号 |
H01L33/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for forming a light-emitting apparatus, comprising:
providing a carrier having a plurality of first metal contacts; forming a light-emitting structure comprising a substrate, a first cladding layer on the substrate, an active layer on the first cladding layer, and a second cladding layer on the active layer; bonding the light-emitting structure to the carrier; forming a cap layer on a side of the light-emitting structure opposite to the carrier; and cutting the carrier and the cap layer to form a chip-scale LED unit. |
| 地址 |
Hsinchu TW |
