发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
摘要 A substrate processing apparatus in which an improved film quality is obtained is disclosed. A precursor gas supply process of supplying a precursor gas to a process chamber while maintaining a substrate accommodated in the process chamber at a first temperature, a first removal process of removing the precursor gas remaining in the process chamber by supplying an inert gas, which is heated at a second temperature higher than the first temperature, to the process chamber, a reaction gas supply process of supplying a reaction gas to the process chamber, and a second removal process of removing the reaction gas remaining in the process chamber by supplying an inert gas to the process chamber are performed.
申请公布号 US2015294860(A1) 申请公布日期 2015.10.15
申请号 US201314432668 申请日期 2013.12.27
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 Ohashi Naofumi
分类号 H01L21/02;C23C16/44;C23C16/455;C23C16/52;C23C16/46 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device, comprising: (a) supplying a precursor gas to a substrate accommodated in a process chamber while maintaining the substrate at a first temperature; (b) supplying a first inert gas, which is heated at a second temperature higher than the first temperature, to the substrate; (c) supplying a reaction gas to the substrate; and (d) supplying a second inert gas to the substrate.
地址 Tokyo JP