发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM |
摘要 |
A substrate processing apparatus in which an improved film quality is obtained is disclosed. A precursor gas supply process of supplying a precursor gas to a process chamber while maintaining a substrate accommodated in the process chamber at a first temperature, a first removal process of removing the precursor gas remaining in the process chamber by supplying an inert gas, which is heated at a second temperature higher than the first temperature, to the process chamber, a reaction gas supply process of supplying a reaction gas to the process chamber, and a second removal process of removing the reaction gas remaining in the process chamber by supplying an inert gas to the process chamber are performed. |
申请公布号 |
US2015294860(A1) |
申请公布日期 |
2015.10.15 |
申请号 |
US201314432668 |
申请日期 |
2013.12.27 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
Ohashi Naofumi |
分类号 |
H01L21/02;C23C16/44;C23C16/455;C23C16/52;C23C16/46 |
主分类号 |
H01L21/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of manufacturing a semiconductor device, comprising:
(a) supplying a precursor gas to a substrate accommodated in a process chamber while maintaining the substrate at a first temperature; (b) supplying a first inert gas, which is heated at a second temperature higher than the first temperature, to the substrate; (c) supplying a reaction gas to the substrate; and (d) supplying a second inert gas to the substrate. |
地址 |
Tokyo JP |