| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To relax a stress applied to a heating element in a semiconductor device where a heating element is connected electrically with a terminal strip. <P>SOLUTION: The semiconductor device 1 comprises a conductive terminal strip 3, a conductive mounting plate 5 formed into a plate thinner than the terminal strip 3 and bonded to the upper surface thereof facing the thickness direction, and a heating element 6 which is bonded to the mounting plate 5 and connected electrically with the terminal strip 3 via the mounting plate 5. The mounting plate 5 has a laminate plate 51 superimposed on the upper surface of the terminal strip 3 and bonded thereto, and an extension plate 52 extending from the circumference of the upper surface of the terminal strip 3 to the outside. The heating element 6 is bonded to any one of both end faces of the extension plate 52 facing the thickness direction. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
