| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a molding method capable of further enhancing heat conductivity of a thermoplastic liquid crystalline resin having superior heat conductivity by the resin alone or a resin composition containing at least the thermoplastic liquid crystalline resin and an inorganic filler. <P>SOLUTION: In this molding method, when performing injection molding of the thermoplastic liquid crystalline resin having a fixed structure and having superior heat conductivity by the resin alone, or the high heat conductivity resin composition containing at least the thermoplastic liquid crystalline resin and the inorganic filler, the injection molding is performed under the condition of a cylinder temperature being Tm to Ti-15(°C), a mold temperature being 90 to Tm-10(°C), and the injection speed being 1×10<SP POS="POST">3</SP>-6×10<SP POS="POST">4</SP>(sec<SP POS="POST">-1</SP>). <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
