| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package equipped with an easily moldable sealing material superior in heat-radiating property. <P>SOLUTION: This sealing material 4 of the semiconductor package is a thermoconductive resin composition obtained by dispersing an inorganic filler in a thermosetting resin in (70:30) to (5:95) range in volume ratio based on the amount of thermosetting resin, and the inorganic oxide filler is formed by the thermoconductive resin composition characterized by comprising (5:95) to (40:60) range magnesium oxide powder and silicon dioxide powder in volume ratio. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
