发明名称 連結システム
摘要 <p>Conventional transfer systems for wafers, etc., transfer the transfer target from the box, through the port provided in the apparatus beforehand, to the apparatus area. Accordingly, these systems have a complex mechanism for connecting the box and port. In light of the above, under the present invention a coupling chamber corresponding to the port is formed only when the transfer box comes in tight contact with the apparatus as the transfer target in the transfer box is transferred into the apparatus, so that the transfer target will be transferred into the apparatus together with the coupling chamber, thereby simplifying the structures of the transfer box and apparatus and also allowing the transfer target to be transferred into the apparatus without fail.</p>
申请公布号 JP5794497(B2) 申请公布日期 2015.10.14
申请号 JP20100131470 申请日期 2010.06.08
申请人 发明人
分类号 H01L21/673 主分类号 H01L21/673
代理机构 代理人
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