发明名称 Apparatus for probing die electricity and method for forming the same
摘要 A method of forming an apparatus for probing die electricity, which determines a reinforcement structure according to features of a converting plate, and combines the converting plate, reinforcement structure and a substrate for forming the apparatus for probing die electricity. In an embodiment, the apparatus for probing die electricity further comprises a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate comprises two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module comprises a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is disposed between the converting plate and the substrate.
申请公布号 US9157929(B2) 申请公布日期 2015.10.13
申请号 US201213706526 申请日期 2012.12.06
申请人 MPI CORPORATION 发明人 Lee Chung-Tse;Wu Chien-Chou;Chan Yi-Ming
分类号 G01R31/00;G01R1/04;G01R31/28 主分类号 G01R31/00
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. An apparatus for probing die electricity, comprising: a substrate; a converting plate, having a first surface and a second surface that are arranged opposite to each other and respectively have a plurality of first and second conductive elements disposed thereon, a first pitch between two neighboring second conductive elements being smaller than a second pitch between two neighboring first conductive elements; a needle module, configured with a plurality of needles; and a reinforcement structure, disposed at a position between the converting plate and the substrate, the reinforcement structure having a plurality of via holes and at least one of the first conductive is being received in each of the via holes; wherein, the plural first conductive elements are arranged coupling respectively to the substrate, and the plural second conductive elements are respectively and electrically connected to the plural needles of the needle module.
地址 Chu-Pei, Hsinchu Shien TW