发明名称 |
Infrared ray sensor package, infrared ray sensor module, and electronic device |
摘要 |
According to the present invention, the gas adsorption capability of a getter can be maintained while the characteristics of an infrared ray sensor element are prevented from being deteriorated. An infrared ray sensor package has an infrared ray sensor element, a base substrate, a housing, an infrared ray transmission window, and a getter. The infrared ray sensor element is vacuum-sealed in a space surrounded by the base substrate, the housing, and the infrared ray transmission window. A spacer is disposed between the infrared ray sensor element and the base substrate to form a gap between the infrared ray sensor element and the base substrate. The getter is arranged in the gap formed between the infrared ray sensor element and the base substrate. A heat shielding member is disposed between the infrared ray sensor element and the getter. The heat shielding member is a heater for heating the infrared ray sensor element or an element formed of alloy containing Ni or heat-resistant glass. |
申请公布号 |
US9157805(B2) |
申请公布日期 |
2015.10.13 |
申请号 |
US201313845897 |
申请日期 |
2013.03.18 |
申请人 |
NEC CORPORATION |
发明人 |
Yamazaki Takao;Kurashina Seiji |
分类号 |
G01J5/04;G01J5/06 |
主分类号 |
G01J5/04 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. An infrared ray sensor package comprising:
an infrared ray sensor element; a base substrate portion electrically connected to the infrared ray sensor element; a housing portion surrounding the infrared ray sensor element; an infrared ray transmission window, the infrared ray sensor element being vacuum-sealed in a space surrounded by the base substrate portion, the housing portion, and the infrared ray transmission window; a getter arranged in a gap between the infrared ray sensor element and the base substrate portion, wherein a cavity is formed between the getter and the base substrate; and a heat shielding member disposed between the infrared ray sensor element and the getter, the heat shielding member comprising a heater for heating the infrared ray sensor element, the heater being provided apart from the getter. |
地址 |
Tokyo JP |