Adhesives including a filler material and related methods

摘要

Temporary adhesives include a thermoplastic polymer comprising from about 30% by weight to about 80% by weight of the temporary adhesive, a solvent comprising from about 20% by weight to about 70% by weight of the temporary adhesive, and a filler material comprising from about 0.2% to about 5% by weight of the temporary adhesive. Methods of processing a semiconductor device wafer include bonding the semiconductor device wafer to a surface of a carrier substrate using a temporary adhesive including a filler material comprising from about 0.2% to about 5% by weight of the temporary adhesive, thinning the semiconductor device wafer, and, while the temporary adhesive remains on the surface of the carrier substrate proximate a peripheral edge thereof, subjecting the thinned semiconductor device wafer to one or more back side processing operations. Methods of forming a thinned semiconductor wafer include using such a temporary adhesive.

主权项

1. An adhesive comprising:
a thermoplastic polymer comprising from about 30% by weight to about 80% by weight of the adhesive; a solvent comprising from about 20% by weight to about 70% by weight of the adhesive, the solvent comprising at least one of n-decane, isododecane, isododecene, d-limonene, and mesitylene; and a filler material comprising from about 0.2% by weight to about 5% by weight of the adhesive.