| 主权项 |
1. A solid-state image pickup device, comprising:
a light receiving unit that converts light incident on a back surface of a semiconductor substrate, said light receiving unit located on a side of a front surface of said semiconductor substrate and within a thickness of said semiconductor substrate; an interconnect layer located over the side of the front surface of said semiconductor substrate; a light shielding film located in said interconnect layer that covers said light receiving unit and prevents light incident on the front surface from entering the semiconductor substrate; a transistor formed adjacently to said light receiving unit; an interconnect electrically connected to said transistor; and an element isolation region, in at least one of the interconnect layer and the semiconductor substrate, that isolates the transistor, wherein said interconnect is formed between said light receiving unit and said light shielding film, wherein said light shielding film covers said transistor, said interconnect, said light receiving unit, and said element isolation region, and wherein said light shielding film is not electrically connected to said interconnect. |
