发明名称 High performance CMOS device design
摘要 A semiconductor device includes a gate, which comprises a gate electrode and a gate dielectric underlying the gate electrode, a spacer formed on a sidewall of the gate electrode and the gate dielectric, a buffer layer having a first portion underlying the gate dielectric and the spacer and a second portion adjacent the spacer wherein the top surface of the second portion of the buffer layer is recessed below the top surface of the first portion of the buffer layer, and a source/drain region substantially aligned with the spacer. The buffer layer preferably has a greater lattice constant than an underlying semiconductor substrate. The semiconductor device may further include a semiconductor-capping layer between the buffer layer and the gate dielectric, wherein the semiconductor-capping layer has a smaller lattice constant then the buffer layer.
申请公布号 US9159629(B2) 申请公布日期 2015.10.13
申请号 US201313961656 申请日期 2013.08.07
申请人 Taiwan Semiconductor Manufacturing Company Ltd. 发明人 Wang Chih-Hao;Chen Shang-Chih;Tsai Ching-Wei;Wang Ta-Wei;Tsai Pang-Yen
分类号 H01L21/8238;H01L29/10;H01L29/66 主分类号 H01L21/8238
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A method comprising: forming over a semiconductor substrate a buffer layer having a lattice constant mismatch with the semiconductor substrate; forming a semiconductor-capping layer over the buffer layer, wherein the semiconductor-capping layer has a lattice constant smaller than a lattice constant of the buffer layer; forming a gate dielectric layer over the buffer layer; forming a gate electrode layer over the gate dielectric layer; patterning the gate dielectric layer and the gate electrode layer to form the gate dielectric and the gate electrode, respectively; etching a semiconductor layer underlying the gate dielectric using the gate electrode and the gate dielectric as an etching mask; after the etching the semiconductor layer, forming a gate spacer on sidewalls of the gate dielectric and the gate electrode, wherein a bottom surface of the gate spacer is in contact with a top surface of the semiconductor-capping layer, and wherein the gate spacer extends below the gate dielectric; recessing a portion of the buffer layer to form a recess, wherein during the recessing, the gate electrode and the gate spacer are used as an etching mask; and forming a source/drain region adjacent to the gate spacer.
地址 Hsin-Chu TW