| 摘要 |
The present invention relates to a substrate supporting device, a substrate processing device including the same, and a substrate processing method using the same. The substrate supporting device comprises: a processing chamber having a space inside wherein a substrate is processed in a space; a heat source unit expanded in a vertical direction, and arranged in the processing chamber; and a support unit including a susceptor dividing the space where the substrate is processed in a lateral direction, a substrate mounting unit having a mounting surface where the substrate is mounted, and a supporting body expanded from the substrate mounting unit to an upper part and coming in contact with at least parts of the areas on an inner surface of the substrate. The substrate processing method comprises: a step of supporting preparation of a coil type substrate on the support unit outside the space where the coil type substrate is processed; a step of loading the support unit where the coil type substrate is vertically inserted, to the space where the coil type substrate is processed; a step of completing the processing of the coil type substrate and unloading the support unit from the space; and the step of separating the coil type substrate from the support unit. As such, the coil type substrate can stably and easily be heated. In other words, the substrate supporting device comes in contact with at least a part of the lower surface and the inner surface of the coil type substrate by being expanded in the vertical direction and supports the inner surface of the substrate. As such, the substrate supporting device resists and prevents heat strain of the substrate which may be generated by an environmental process in a heating process of the substrate, thereby improving quality of the product. |
