发明名称 |
PLACEMENT OF COMPONENT IN CIRCUIT BOARD INTERMEDIATE PRODUCT BY FLOWABLE ADHESIVE LAYER ON CARRIER SUBSTRATE |
摘要 |
A method of manufacturing a circuit board (600)or a circuit board intermedi- ate product(400), wherein the method comprises providing a carrier structure (100), applying a layer of flowable low-viscosity adhesive(300) on the carrier structure (100) over a surface area (302) of the carrier structure (100) which is larger than a mounting area (404) in which an electronic component (402) is to be mounted on the carrier structure (100), and pressing the electronic component (402) into a subsection of the layer of adhesive(300) in the mounting area (404) so that at least part of the electronic component (402) is immersed within the adhesive(300). |
申请公布号 |
WO2015150474(A1) |
申请公布日期 |
2015.10.08 |
申请号 |
WO2015EP57216 |
申请日期 |
2015.04.01 |
申请人 |
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT |
发明人 |
WEIDINGER, GERALD;SCHWARZ, TIMO;ZLUC, ANDREAS |
分类号 |
H05K3/00;H05K3/30;H05K3/46 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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