发明名称 CHIP COIL COMPONENT AND BOARD FOR MOUNTING THE SAME
摘要 A chip coil component may include: a ceramic body in which a plurality of magnetic layers are stacked; and an internal coil part disposed inside the ceramic body and having a plurality of internal coil patterns disposed on the plurality of magnetic layers to be electrically connected. The ceramic body may include an active layer, which is a capacitance forming part, and first and second cover layers disposed on and below the active layer in a thickness direction of the ceramic body, and a thickness of the second cover layer may be greater than that of the first cover layer.
申请公布号 US2015287514(A1) 申请公布日期 2015.10.08
申请号 US201414320087 申请日期 2014.06.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LIM Bong Sup
分类号 H01F27/28;H01F27/29;H01F27/06 主分类号 H01F27/28
代理机构 代理人
主权项 1. A chip coil component, comprising: a ceramic body in which a plurality of magnetic layers are stacked; and an internal coil part disposed inside the ceramic body and having a plurality of internal coil patterns disposed on the plurality of magnetic layers and electrically connected to each other, wherein the ceramic body includes an active layer, which is a capacitance forming part, and first and second cover layers disposed on and below the active layer in a thickness direction of the ceramic body, and a thickness of the second cover layer is greater than that of the first cover layer.
地址 Suwon-Si KR