发明名称 |
CHIP COIL COMPONENT AND BOARD FOR MOUNTING THE SAME |
摘要 |
A chip coil component may include: a ceramic body in which a plurality of magnetic layers are stacked; and an internal coil part disposed inside the ceramic body and having a plurality of internal coil patterns disposed on the plurality of magnetic layers to be electrically connected. The ceramic body may include an active layer, which is a capacitance forming part, and first and second cover layers disposed on and below the active layer in a thickness direction of the ceramic body, and a thickness of the second cover layer may be greater than that of the first cover layer. |
申请公布号 |
US2015287514(A1) |
申请公布日期 |
2015.10.08 |
申请号 |
US201414320087 |
申请日期 |
2014.06.30 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LIM Bong Sup |
分类号 |
H01F27/28;H01F27/29;H01F27/06 |
主分类号 |
H01F27/28 |
代理机构 |
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代理人 |
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主权项 |
1. A chip coil component, comprising:
a ceramic body in which a plurality of magnetic layers are stacked; and an internal coil part disposed inside the ceramic body and having a plurality of internal coil patterns disposed on the plurality of magnetic layers and electrically connected to each other, wherein the ceramic body includes an active layer, which is a capacitance forming part, and first and second cover layers disposed on and below the active layer in a thickness direction of the ceramic body, and a thickness of the second cover layer is greater than that of the first cover layer. |
地址 |
Suwon-Si KR |