发明名称 HIGH TEMPERATURE ELECTROMAGNETIC COIL ASSEMBLIES
摘要 Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the high temperature electromagnetic coil assembly includes a coiled anodized aluminum wire and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded. The electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire.
申请公布号 US2015287522(A1) 申请公布日期 2015.10.08
申请号 US201314035560 申请日期 2013.09.24
申请人 Honeywell International Inc. 发明人 Piascik James;Passman Eric;Oboodi Reza;Franconi Robert;Fox Richard;Seminara Gary J.;Holden Gene;Harding Jacob
分类号 H01F27/32;H01F27/28;H01F27/04 主分类号 H01F27/32
代理机构 代理人
主权项 1. A high temperature electromagnetic coil assembly, comprising: a coiled anodized aluminum wire; and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded; wherein the electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire.
地址 Morristown NJ US