发明名称 |
HIGH TEMPERATURE ELECTROMAGNETIC COIL ASSEMBLIES |
摘要 |
Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the high temperature electromagnetic coil assembly includes a coiled anodized aluminum wire and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded. The electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire. |
申请公布号 |
US2015287522(A1) |
申请公布日期 |
2015.10.08 |
申请号 |
US201314035560 |
申请日期 |
2013.09.24 |
申请人 |
Honeywell International Inc. |
发明人 |
Piascik James;Passman Eric;Oboodi Reza;Franconi Robert;Fox Richard;Seminara Gary J.;Holden Gene;Harding Jacob |
分类号 |
H01F27/32;H01F27/28;H01F27/04 |
主分类号 |
H01F27/32 |
代理机构 |
|
代理人 |
|
主权项 |
1. A high temperature electromagnetic coil assembly, comprising:
a coiled anodized aluminum wire; and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded; wherein the electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire. |
地址 |
Morristown NJ US |