发明名称 SUBSTRATE-LESS DOUBLE-SIDED ADHESIVE TAPE AND METHOD OF PRODUCING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate-less double-sided adhesive tape that can be produced not through a complex process and comprises an adhesive layer that is resistant to interlayer peeling.SOLUTION: A substrate-less double-sided adhesive tape 1 comprises a first adhesive layer 11, a second adhesive layer 12 put on one face of the first adhesive layer 11, and a first peeling sheet 21 put on the other face of the first adhesive layer 11 in a peelable manner. The substrate-less double-sided adhesive tape 1 is a co-extrusion molding formed from a first peeling resin composition for forming the first peeling sheet 21, a first resin composition for forming the first adhesive layer 11, and a second resin composition for forming the second adhesive layer 12. The first peeling sheet 21 can be peeled from the first adhesive layer 11.</p>
申请公布号 JP2015178575(A) 申请公布日期 2015.10.08
申请号 JP20140057163 申请日期 2014.03.19
申请人 LINTEC CORP 发明人 MIYAZAKI KENTARO;NAKAMURA JUNICHI;TAYA NAOKI
分类号 C09J7/00;B32B27/00;C09J201/00 主分类号 C09J7/00
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