DIE BOND FILM, DICING SHEET ATTACHED DIE BOND FILM, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

The present invention provides a die bond film capable of easily checking for chipping for a semiconductor chip. When a light penetration rate in of a wavelength of 400 nm before heat curing is T1 (%), and a light penetration rate of a wavelength of 400 nm after heating for an hour at a temperature of 120°C is T2 (%); T1 is equal to or greater than 80%, and the difference between T1 and T2 (T1-T2) is equal to or lower than 20%.