METHOD FOR MOUNTING AN ELECTRICAL COMPONENT IN WHICH A HOOD IS USED, AND A HOOD THAT IS SUITABLE FOR USE IN THIS METHOD

摘要

The invention relates to a method for mounting an electrical component (12) on a substrate (13). According to the invention, joining is simplified using a hood (11) by virtue of a contact structure (16) being provided in said hood and, when the hood (11) is placed on, this then being joined on different joining levels (28, 29) simultaneously using an additional material (35). Moreover, a required joining pressure, such as is necessary for example in diffusion or sintered bonds for electrical contacts, can be built by means of said hood. The invention also relates to a hood that is suitable for use in said method.