| 摘要 |
Provided is an OLED substrate cutting device which enables the reduction of cracking of a barrier layer. An OLED substrate cutting device (1) is a device for cutting an OLED substrate (2) provided with a substrate, a barrier layer provided on one surface side of the substrate, a plurality of layers provided on a portion on one surface side of the barrier layer, and an adhesive sheet provided on the other surface side of the substrate, and is provided with a base part (10) to which the adhesive sheet is affixed, and a first blade part (21) which cuts the OLED substrate from the side of the plurality of layers in a state where the adhesive sheet is affixed to the base part (10). The first blade part (21) is a linear blade longer than the width of the OLED substrate (2), and cuts the OLED substrate (2) in a state where both ends of the first blade part (21) are respectively located outside both ends of the OLED substrate (2). |
