METHOD FOR MANUFACTURING FLEXIBLE COPPER CLAD LAMINATE WITH METALIZED THROUGH-HOLE

摘要

A method for manufacturing a flexible copper clad laminate with a metalized through-hole. The method comprises: forming a hole structure on a flexible organic film (101); forming a conductive seed crystal layer on the wall of the hole structure and the surface of the flexible organic film (102); and forming a metal conductor layer on the conductive seed crystal layer (103). The method can simplify the process of manufacturing a flexible copper clad laminate with a metalized through-hole, and can improve conductive performance of the metalized through-hole in the flexible copper clad laminate.