发明名称 SUBSTRATE PROCESSING METHOD, PROGRAM, CONTROL DEVICE, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate processing method by which a processing result of a substrate can be known from a small number of monitor substrates.SOLUTION: The substrate processing method for applying processing to a substrate while placing at least monitor substrates within a substrate holder including a plurality of slots includes: a first acquisition step of acquiring a first processing condition in first processing that is implemented while including a first number of monitor substrates, and a first processing result relating to the monitor substrates; a second acquisition step of acquiring a second processing condition in second processing that is implemented while including a second number of monitor substrates, the second number being greater than the first number, and a second processing result relating to the monitor substrates; a first calculation step of calculating a processing condition difference between the first processing condition and the second processing condition; and a second calculation step of calculating a processing result of the substrate at a slot position where no monitor substrate is mounted in the first processing, on the basis of the first processing result, the second processing result, the processing condition difference and a process model indicating relations between the processing conditions and the processing results.</p>
申请公布号 JP2015179752(A) 申请公布日期 2015.10.08
申请号 JP20140056827 申请日期 2014.03.19
申请人 TOKYO ELECTRON LTD 发明人 TAKENAGA YUICHI;SAITO TAKANORI
分类号 H01L21/02;H01L21/31 主分类号 H01L21/02
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