发明名称 METHOD FOR CUTTING BRITTLE-MATERIAL SUBSTRATE
摘要 A cutting edge (51) is pressed against a brittle-material substrate (4) so that a protruding part (PP) of the cutting edge (51) is arranged between a first edge (ED1) of the brittle-material substrate (4) and the side part (PS) of the cutting edge (51) and so that the side part (PS) of the cutting edge (51) is arranged between the protruding part (PP) of the cutting edge (51) and a second edge (ED2) of the brittle-material substrate (4). A scribe line is formed by scratching on the brittle-material substrate (4) between a first position closer to the first edge (ED1) of the first and second edges (ED1, ED2) and a second position closer to the second edge (ED2) of the first and second edges (ED1, ED2). After the scribe line has been formed, a crack line is formed by extending a crack in the direction of thickness (DT) from the second position to the first position along the scribe line.
申请公布号 WO2015151755(A1) 申请公布日期 2015.10.08
申请号 WO2015JP57316 申请日期 2015.03.12
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 SOYAMA HIROSHI
分类号 B28D5/00;C03B33/10 主分类号 B28D5/00
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