Method for creating an opening through a substrate

摘要

The method of introducing a through hole in a substrate by an electromagnetic radiation (8), comprises predetermining a cutting line (7) for cutting a polygonal surface along the through hole, which is introduced by corner points (6) of connected side lines in the substrate. The cutting line is continuously initiated in an inner area of the surface spaced apart from the sidelines with a recess to a starting point spaced apart from a point of discontinuity on the sideline and further along all sidelines. The starting point of the side line is divided in a longitudinal sideline section. The method of introducing a through hole in a substrate by an electromagnetic radiation (8), comprises predetermining a cutting line (7) for cutting a polygonal surface along the through hole, which is introduced by corner points (6) of connected side lines in the substrate. The cutting line is continuously initiated in an inner area of the surface spaced apart from the sidelines with a recess to a starting point spaced apart from a point of discontinuity on the sideline and further along all sidelines. The starting point of the side line is divided in a longitudinal sideline section and a short sideline section. The cutting line starting from the starting point is introduced with the longitudinal sideline section and the subsequent sidelines in the short sideline section. The length of the short sideline section corresponds to 5-15% of the total length of the sum of the short sideline section and the longitudinal sideline section. The short sideline section having a length of 0.05-0.25 mm is introduced. The recess having the longitudinal sideline section includes an angle. The recess having the length of 0.05-0.25 mm of a side length of the sideline connected with the short sideline section and/or the longitudinal sideline section is introduced. The recess is connected with the starting point on a longitudinal sideline. The sidelines have a length of 50 mu m and 10 mm.