发明名称 Cooling flow optimization
摘要 A remote power unit (10) has an inlet duct (16) and an outlet duct (16) in a housing (12). The inlet and outlet ducts (16) are configured to receive and expel cooling air from the remote power unit (10). A plurality of slots (18;118) within the housing (12) each hold a printed wiring board (14). A door (20; 120) is attached to each of the slots (18; 118), and each door (20; 120) has a shape thermal memory element (26). The shape thermal memory element (26) is used to open and close the doors (20; 120) to either allow or prevent cooling airflow from passing along the printed wiring board (14;114). In this way, cooling air use is reduced to only those areas where cooling is needed.
申请公布号 EP2928276(A1) 申请公布日期 2015.10.07
申请号 EP20150159280 申请日期 2015.03.16
申请人 HAMILTON SUNDSTRAND CORPORATION 发明人 PAL, DEBABRATA
分类号 H05K7/20 主分类号 H05K7/20
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