| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cleaning device which can prevent unnecessary damage to a substrate and the circuit pattern collapse while removing foreign matter in a specific place, in cleaning processing. <P>SOLUTION: A cleaning device includes a processing fluid nozzle 7 for ejecting a processing fluid used for cleaning processing to a substrate 5 and a recovery unit 8 for recovering the processing fluid from the substrate 5. Since the substrate 5 can be subjected to cleaning processing locally using the processing fluid from the processing fluid nozzle 7, unnecessary damage to the substrate 5 and the circuit pattern collapse are prevented while removing foreign matter in a specific place. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
