| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board excellent in heat dissipation.SOLUTION: A circuit board 1 is used which includes: a printed board 10 including an insulating substrate provided with at least one through hole, a conductor pattern layer formed on both surfaces of the insulating substrate, a first metal plating layer covering an inner wall of the through hole and the conductor pattern layer formed on both surfaces of the insulating substrate, a metal thermally conductive member arranged in the through hole so as to be in close contact with the first metal plating layer, and a second metal plating layer formed on both surfaces of the insulating substrate so as to continuously cover the conductor pattern layer and an end surface of the thermally conductive member; an electronic component 21 provided at that position of one surface of the printed board 10 which faces the thermally conductive member, and thermally connected to the thermally conductive member via the second metal plating layer; and a radiator provided at that position of the other surface of the printed board which faces the thermally conductive member, and thermally connected to the thermally conductive member via the second metal plating layer.</p> |
