| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet in which the occurrence of a rolling trace is prevented even when rolled in a roll shape.SOLUTION: In the adhesive sheet 1, a pressure-sensitive adhesive layer 12 and a base film 13 on a spacer layer 14 are protruded in a circular ring shape between a releasable substrate 2 and the pressure-sensitive adhesive layer 12 by the spacer layer 14 provided in a circular ring shape on an end part on the one surface side of an adhesive layer 11. As a result, the protrusion of the pressure-sensitive adhesive layer 12 and the base film 13 bumps against another wound portion of the adhesive sheet 1 when the adhesive sheet 1 is rolled in a roll shape. Therefore, the pressure applied from another adhesive layer 11 to the surface of the adhesive layer 11 is alleviated, and the occurrence of the rolling trace is prevented. Because the occurrence of the rolling trace is prevented, smoothness of the adhesive sheet 1 is kept, air is prevented from being captured between a semiconductor wafer and the adhesive layer 11 when the adhesive sheet 1 is stuck to the semiconductor wafer, and the production yield of a semiconductor element is improved. |
