发明名称 FILM COOLING STRUCTURE
摘要 <p>A film cooling structure 10 includes a structural wall 11 that has an outer surface 12 exposed to combustion gas and an inner surface 13 positioned opposite to the outer surface 12, and film cooling holes 14 are formed at the structural wall 11 and introduce cooling air from the inner surface 13 toward the outer surface 12 in order to perform film cooling. The film cooling hole 14 includes an introducing portion 14a that extends to a middle position in the structural wall 11 from the inner surface 13 toward the outer surface 12, an enlarged portion 14b of which the cross-sectional area is gradually increased toward the outer surface 12 from an end of an outer surface side of the introducing portion14a and which is opened at the outer surface 12, and a partition portion 16 that partitions the inside of the enlarged portion 14b into a plurality of spaces in a width direction of the hole perpendicular to a flow direction of the combustion gas.</p>
申请公布号 EP2083147(B1) 申请公布日期 2015.10.07
申请号 EP20070738382 申请日期 2007.03.13
申请人 IHI CORPORATION 发明人 OHKITA, YOJI
分类号 F01D5/18;F01D9/02;F01D25/12;F01D25/24;F02C7/18 主分类号 F01D5/18
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