发明名称 Semiconductor devices comprising a fin
摘要 A semiconductor device may include a fin disposed over a workpiece. The fin may include: a first semiconductive material disposed over the workpiece; an oxide of the first semiconductive material disposed over the first semiconductive material; a second conductive material disposed over and spaced apart from the oxide of the first semiconductive material; a first insulating material disposed around and lining the second semiconductive material; a conductive material disposed around the first insulating material; and a second insulating material disposed between the oxide of the first semiconductive material and a portion of the conductive material facing the workpiece, the second insulating material further lining sidewalls of the conductive material.
申请公布号 US9153657(B2) 申请公布日期 2015.10.06
申请号 US201414514201 申请日期 2014.10.14
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chen Chi-Yuan;Tsai Teng-Chun;Lin Kuo-Yin;Pan Wan-Chun;Chang Hsiang-Pi;Ju Shi Ning;Chen Yen-Yu;Luan Hongfa;Ching Kuo-Cheng
分类号 H01L21/00;H01L29/423;H01L29/78;H01L29/16;H01L29/20;H01L29/24;H01L29/49;H01L29/66 主分类号 H01L21/00
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A semiconductor device comprising: a fin disposed over a workpiece, the fin comprising: a first semiconductive material disposed over the workpiece;an oxide of the first semiconductive material disposed over the first semiconductive material;a second semiconductive material disposed over the oxide of the first semiconductive material;a conductive material disposed over and around the second semiconductive material, a portion of the conductive material being disposed between the oxide of the first semiconductive material and the second semiconductive material;a first insulating material disposed around the second semiconductive material, a first portion of the first insulating material being disposed between a top surface of the second semiconductive material and the conductive material, a second portion of the first insulating material being disposed between a bottom surface of the second semiconductive material and the conductive material; anda second insulating material disposed around regions of the conductive material, a portion of the second insulating material being disposed between the conductive material and the oxide of the first semiconductive material, wherein the conductive material comprises a gate of a gate-all-around (GAA) fin field effect transistor (FinFET), and wherein the second semiconductive material comprises a channel region of the GAA FinFET.
地址 Hsin-Chu TW