发明名称 |
Semiconductor devices comprising a fin |
摘要 |
A semiconductor device may include a fin disposed over a workpiece. The fin may include: a first semiconductive material disposed over the workpiece; an oxide of the first semiconductive material disposed over the first semiconductive material; a second conductive material disposed over and spaced apart from the oxide of the first semiconductive material; a first insulating material disposed around and lining the second semiconductive material; a conductive material disposed around the first insulating material; and a second insulating material disposed between the oxide of the first semiconductive material and a portion of the conductive material facing the workpiece, the second insulating material further lining sidewalls of the conductive material. |
申请公布号 |
US9153657(B2) |
申请公布日期 |
2015.10.06 |
申请号 |
US201414514201 |
申请日期 |
2014.10.14 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chen Chi-Yuan;Tsai Teng-Chun;Lin Kuo-Yin;Pan Wan-Chun;Chang Hsiang-Pi;Ju Shi Ning;Chen Yen-Yu;Luan Hongfa;Ching Kuo-Cheng |
分类号 |
H01L21/00;H01L29/423;H01L29/78;H01L29/16;H01L29/20;H01L29/24;H01L29/49;H01L29/66 |
主分类号 |
H01L21/00 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A semiconductor device comprising:
a fin disposed over a workpiece, the fin comprising:
a first semiconductive material disposed over the workpiece;an oxide of the first semiconductive material disposed over the first semiconductive material;a second semiconductive material disposed over the oxide of the first semiconductive material;a conductive material disposed over and around the second semiconductive material, a portion of the conductive material being disposed between the oxide of the first semiconductive material and the second semiconductive material;a first insulating material disposed around the second semiconductive material, a first portion of the first insulating material being disposed between a top surface of the second semiconductive material and the conductive material, a second portion of the first insulating material being disposed between a bottom surface of the second semiconductive material and the conductive material; anda second insulating material disposed around regions of the conductive material, a portion of the second insulating material being disposed between the conductive material and the oxide of the first semiconductive material, wherein the conductive material comprises a gate of a gate-all-around (GAA) fin field effect transistor (FinFET), and wherein the second semiconductive material comprises a channel region of the GAA FinFET. |
地址 |
Hsin-Chu TW |