Thin film encapsulation of organic light emitting diodes

摘要

A low temperature, low cost method of encapsulating organic light emitting diodes (OLED) that avoids damage to the OLED device. A metal passivation layer is formed using a plasma, UV-ozone, or wet chemical treatment, wherein the metal passivation layer serves to encapsulate and protect the OLED from moisture and oxygen. Alternatively, a buffer layer and a metal layer are formed onto the OLED and the metal layer is treated using a plasma, UV-ozone, or wet chemical treatment, to form a metal passivation layer that serves to encapsulate and protect the OLED from moisture and oxygen.

主权项

1. A method for encapsulating an organic light emitting diode (OLED) device, the method comprising:
providing a fabricated organic light emitting diode having a substrate, an anode layer formed on the substrate, an organic electroluminescent layer formed on the anode layer, and a cathode layer formed on the organic electroluminescent layer; and treating the cathode layer to produce a passivation layer on a surface of the cathode layer wherein treating comprises treating with plasma, UN-ozone, or wet chemicals.