| 发明名称 | Heatsink attachment module | ||
| 摘要 | An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module subassembly chip face down in the fixture. | ||
| 申请公布号 | US9153460(B2) | 申请公布日期 | 2015.10.06 |
| 申请号 | US201314011218 | 申请日期 | 2013.08.27 |
| 申请人 | International Business Machines Corporation | 发明人 | Colgan Evan G.;Gaynes Michael A.;Zitz Jeffrey A. |
| 分类号 | H01L23/00;H01L21/50;H01L23/433;H01L23/31 | 主分类号 | H01L23/00 |
| 代理机构 | Cantor Colburn LLP | 代理人 | Cantor Colburn LLP ;Percello Louis |
| 主权项 | 1. An assembly process for a heatsink attachment module for a chip packaging apparatus, the process comprising: attaching a semiconductor chip to a substrate to form a module subassembly; placing a load frame and shim in a fixture; dispensing adhesive to the load frame; loadably placing the module subassembly chip face down in the fixture; and curing the adhesive. | ||
| 地址 | Armonk NY US | ||