| 主权项 |
1. An electronic module, comprising:
a substrate comprising a dielectric material having multiple sides, including first, second and third sides, and first, second and third cavities indented respectively within the first, second and third sides, wherein the second side is parallel to and opposite the first side, whereby the first and second cavities open in mutually-opposing directions, while the third side is non-parallel to the first and second sides, wherein the substrate comprises multiple layers of the dielectric material, which are graduated in size and comprise first and second layers having respective central openings that define the first and second cavities, and wherein the layers are joined together so as to define the cavities in the substrate, wherein the third cavity is defined by the graduated sizes of the layers; first, second and third conductive contacts within the first, second and third cavities, configured for contact with at least first, second and third electronic components that are mounted respectively in the first, second and third cavities; conductive traces within the substrate in electrical communication with the first, second and third conductive contacts; and a plurality of contact pads disposed on respective exterior surfaces of at least the first and third sides of the substrate and connected to the conductive traces, wherein the contact pads on one of the respective exterior surfaces are configured for contacting a printed circuit board, while the contact pads on the other of the respective exterior surfaces are configured for contacting another module. |
