Semiconductor package with improved testability

摘要

An exemplary implementation of the present disclosure includes a testable semiconductor package that includes an active die having interface contacts and dedicated testing contacts. An interposer is situated adjacent a bottom surface of the active die, the interposer providing electrical connections between the interface contacts and a bottom surface of the testable semiconductor package. At least one conductive medium provides electrical connection between at least one of the dedicated testing contacts and a top surface of the testable semiconductor package. The at least one conductive medium can be coupled to a package-top testing connection, which may include a solder ball.

主权项

1. A testable semiconductor package comprising:
an active die having interface contacts and dedicated testing contacts; an interposer situated adjacent to a bottom surface of said active die, said interposer providing electrical connections between said interface contacts and a bottom surface of said testable semiconductor package; and at least one conductive medium providing electrical connection between at least one of said dedicated testing contacts and a top surface of said testable semiconductor package.