| 主权项 |
1. A method of making a heat radiating structure for high-power LED comprises:
step (1): providing a printed circuit board, a heat conducting plate having a heat conducting column arranged at one side thereof, and a heat radiating plate; step (2): after the step (1) is complete, providing a locating hole penetrating the surface of both sides of the printed circuit board, and welding a copper plate to the surface of one side of the printed circuit board, while soldering an electrode welding leg to the surface of the other side of the printed circuit board, then coating the surface of the copper plate with a solder paste; step (3): after the step (2) is complete, putting the heat conducting column from the surface welded with the copper plate into the locating hole, and soldering the copper plate and the heat conducting plate together through reflow soldering, the heat conducting plate and the printed circuit board then being fixedly connected together; wherein the height of the heat conducting column is greater than the sum of the thicknesses of the copper plate, the printed circuit board and the electrode welding leg; step (4): after the step (3) is complete, placing the heat conducting plate and the printed circuit board that are fixedly connected together and produced by the step (3) on a pressing equipment, and utilizing the pressing equipment to press the upper-end surface of the heat conducting column so as to adjust the height of the heat conducting column, and to make the upper-end surface of the heat conducting column and the upper surface of the electrode welding leg be on the same plane; and step (5): after the step (4) is complete, pasting the surface of an inner side of the heat radiating plate on the surface of the other side of the heat conducting plate fixedly to form the heat radiating structure for high-power LED. |
