发明名称 Cu-Ti-BASED COPPER ALLOY SHEET MATERIAL, MANUFACTURING METHOD THEREFOR AND ELECTRIC CONDUCTION COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To improve durability under severe valuation criteria recognized with a test specimen having similar shape to a mounting component having 180° U-shaped bent part in a Cu-Ti-based copper alloy sheet material.SOLUTION: There is provided a copper alloy sheet material of Cu-Ti-based copper alloy containing Ti:2.0 to 4.0 mass% and having a number density of granular deposition having a diameter of 500 nm or more is 10.0×10/mmor less and the number ratio of a grain boundary segment where grain boundary phase having width of over 500 nm exists is 5.0% or less when grain boundary part sandwiched between intersection points of the crystal grain boundary is called as a "grain boundary segment", in a metallic structure of a cross section vertical to a rolling direction.</p>
申请公布号 JP2015175053(A) 申请公布日期 2015.10.05
申请号 JP20140054198 申请日期 2014.03.17
申请人 DOWA METALTECH KK 发明人 KIMURA TAKASHI;KAMATA TOSHIYA;KO IRIN;SUZUKI MOTOHIKO;SASAKI FUMIAKI
分类号 C22C9/00;C22F1/08;H01B5/02;H01B13/00 主分类号 C22C9/00
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