发明名称 |
MULTILAYER FILM, MOLDED FILM, AND PACKAGE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer film achieving both of gas barrier property and moldability without accompanying a stretching process, a molded film, and a package.SOLUTION: The multilayer film includes a repeated part 15 formed by alternately and repeatedly stacking a first layer 11 comprising a thermoplastic crystalline resin (A) and a second layer 12 comprising a thermoplastic resin (B) different from the crystalline resin (A), in which an average layer thickness a [nm] of the first layer 11 and an average layer thickness b [nm] of the second layer 12 satisfy a relationship of a≤b.</p> |
申请公布号 |
JP2015174250(A) |
申请公布日期 |
2015.10.05 |
申请号 |
JP20140050866 |
申请日期 |
2014.03.13 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
KAI HIDEKI;MAESO SHINICHI |
分类号 |
B32B27/00;B65D1/00;B65D65/40;B65D75/34;B65D81/24;B65D83/04 |
主分类号 |
B32B27/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|