发明名称 MULTILAYER FILM, MOLDED FILM, AND PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To provide a multilayer film achieving both of gas barrier property and moldability without accompanying a stretching process, a molded film, and a package.SOLUTION: The multilayer film includes a repeated part 15 formed by alternately and repeatedly stacking a first layer 11 comprising a thermoplastic crystalline resin (A) and a second layer 12 comprising a thermoplastic resin (B) different from the crystalline resin (A), in which an average layer thickness a [nm] of the first layer 11 and an average layer thickness b [nm] of the second layer 12 satisfy a relationship of a≤b.</p>
申请公布号 JP2015174250(A) 申请公布日期 2015.10.05
申请号 JP20140050866 申请日期 2014.03.13
申请人 SUMITOMO BAKELITE CO LTD 发明人 KAI HIDEKI;MAESO SHINICHI
分类号 B32B27/00;B65D1/00;B65D65/40;B65D75/34;B65D81/24;B65D83/04 主分类号 B32B27/00
代理机构 代理人
主权项
地址