发明名称 GRINDER
摘要 Disclosed is a grinder. The grinder according to an embodiment of the present invention comprises: a polishing plate for conducting a polishing operation for a workpiece by rotation; a dust-collecting cover including an upper surface cover for enveloping the upper surface of the polishing plate and a side surface cover for enveloping the circumference part of the polishing plate to prevent the diffusion of dust generated by the polishing operation; and a pressurizing unit for pressurizing a part of the polishing plate to conduct a polishing operation for a part of the workpiece.
申请公布号 KR20150110883(A) 申请公布日期 2015.10.05
申请号 KR20140032876 申请日期 2014.03.20
申请人 SAMSUNG HEAVY IND. CO., LTD. 发明人 PARK, SOON WOOK;SI, DAE YOUB;LEE, SANG HUEN
分类号 B24B55/06;B24B55/04 主分类号 B24B55/06
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