| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a conductive ball mounting device which enables improvement of the matching level between a pad of a substrate and conductive balls.SOLUTION: A conductive ball mounting device 100 of the invention includes: a mask 110 having a thickness which is equivalent to or larger than a diameter of a conductive ball, the mask 110 where an opening part 115, through which the conductive balls are adsorbed or desorbed, is formed; a frame 120 which includes a vacuum hole 125 and is formed so as to enclose a side surface and an upper part of the mask 110; and a porous member 150 formed between the frame 120 and an upper part of the mask 110.</p> |
