| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate for a printed wiring board having an excellent fine wiring processability.SOLUTION: A method of manufacturing a laminate 100 firstly prepares a plastic film 200 with an insulating layer configured by laminating an insulating layer 101 and a plastic film 103, and a substrate 107 having a circuit layer 105 on one side or on both sides. Next, while an insulating layer 101 side surface of the plastic film 200 with an insulating layer is directed to the circuit layer 105 side surface of the substrate 107, the plastic film 200 with an insulating layer is laminated on the circuit layer 105 of the substrate 107 to obtain a lamination body 150. Thereafter, the plastic film 103 is peeled off from the obtained lamination body 150. Here, a projecting mountain height (Rpk) of a surface at a side contacted with the insulating layer 101, of the plastic film 103 defined by JIS B0671-2:2002 (ISO13565-2:1996), is 5 nm or more and 50 nm or less. |
