| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can prevent occurrence of cracks at a solder joint portion.SOLUTION: A second semiconductor chip having a first penetration via and a second electrode pad coupled to the first penetration via is mounted on a first semiconductor chip having a first electrode pad while the first and second electrode pads are positioned to each other. A third semiconductor chip having a second penetration via, a third electrode joined to the via on one surface, a wire formed through a protection film on the other surface to be joined to the second penetration via through a protection film on the other surface and a fourth electrode pad formed on the other surface to be joined to the wire are mounted on the second semiconductor chip while the second and third electrode pads are positioned to each other. The first to third electrode pads are joined to electrically connect the first to third semiconductor chips, and resin fills void spaces of a laminate having the first to third semiconductor chip. A solder bump on the substrate and the fourth electrode pad of each laminate are positioned and joined to each other, and plural laminates are fixed by adhesive material. Finally, the laminate and one surface of the substrate are sealed with mold resin, and then the plural laminates are packaged and diced into individual pieces. |
